Global Memory and Storage Technology Market Report Outlook 2027-2037: AI Demand Reshapes Supply, Pricing and Investment
Dublin, Aug. 13, 2026 (GLOBE NEWSWIRE) — The “The Global Memory and Storage Technology Market 2027-2037” has been added to ResearchAndMarkets.com’s offering.
The global memory and storage market is experiencing an unprecedented supply-demand imbalance as artificial intelligence infrastructure transforms industry economics. Established market cycles are being disrupted, with DRAM revenue projected to grow 144% in 2026 despite bit-supply growth of approximately 16%. Conventional DRAM contract prices have increased by as much as 95% in a single quarter, significantly above the previous historical peak of around 35%. As a result, total memory and storage revenue is expected to approximately double between 2025 and 2026.
This shift is structural. High Bandwidth Memory (HBM) requires roughly three times the wafer area per bit of conventional DDR5 after accounting for through-silicon vias, known-good-die losses and base-die requirements. Manufacturers are prioritising HBM production because of its stronger profitability, increasing its share of DRAM wafer starts from approximately 20% toward 40% by 2037. This transition is constraining conventional DRAM and NAND availability even as overall production investment rises.
Memory manufacturers are currently fulfilling only half to two-thirds of core customer demand. HBM capacity is sold out through the end of 2027, while hard disk drive capacity is sold out for 2026. Near-term relief remains limited by lengthy construction and qualification schedules. Samsung and SK hynix have committed a combined 800 trillion won ($518 billion) to new fabrication facilities in South Korea, Micron has increased planned US investment to more than $250 billion, and SK hynix is developing a $4 billion HBM packaging facility in Indiana.
New memory fabrication plants require at least three years to begin production and five to seven years to achieve full capacity. With leading producers expanding in response to the same market signals, substantial new supply is expected to enter within a concentrated period. The market is therefore forecast to undergo a capacity-led correction beginning in 2029, reach a trough in 2030 and subsequently return to bit-led growth.
Underlying memory demand is not expected to decline during the forecast period. AI inference, test-time scaling, long-context reasoning and agentic AI workloads are increasing requirements across GPU memory, CPU RAM and enterprise SSD infrastructure. At the same time, embedded flash scaling constraints are accelerating investment in MRAM, ReRAM and ferroelectric memory. Memory and storage technologies are increasingly being treated as strategic infrastructure, influencing procurement, pricing, capacity allocation and long-term supply agreements.
The Global Memory and Storage Technology Market 2027-2037 provides a comprehensive assessment of the industry across the AI-driven supercycle of 2026-2028, the anticipated capacity correction of 2029-2030 and the subsequent recovery. The report combines revenue forecasts anchored to reported 2026 producer results with technology roadmaps, manufacturing capacity analysis, pricing models and profiles of 173 companies.
Annual forecasts from 2026 to 2037 cover major memory and storage technologies, applications and regions. Revenue is separated into bit growth and average selling price components, enabling clearer analysis of cyclical and structural market drivers. The study also includes upside, base and downside scenarios, a ten-point risk register, wafer-capacity modelling, supply-demand balance analysis, node-migration yield and cost curves, and technology-readiness assessments for emerging memory platforms.
Report coverage includes:
- Global memory and storage market forecasts from 2026 to 2037, covering the supercycle peak, correction, trough and bit-led recovery.
- Technology forecasts for conventional DRAM, HBM, NAND flash, HDDs, SSD controllers, storage systems and emerging non-volatile memory.
- Application analysis across data centres, AI infrastructure, mobile devices, PCs, automotive, industrial, consumer and enterprise storage markets.
- Regional forecasts across eight markets, including analysis of China’s capacity expansion, export controls, tariffs and supply-chain regionalisation.
- DRAM roadmaps covering 1a-to-0d node progression, 6F2-to-4F2 migration, 3D DRAM, capacitor-less architectures and gain-cell designs.
- HBM analysis spanning HBM3E through HBM6, custom HBM, TSV stacking, hybrid bonding, thermal management and processor integration.
- NAND flash roadmaps covering scaling beyond 300 and 1,000 layers, CMOS Bonded Array, Xtacking, TLC, QLC, PLC and High-Bandwidth Flash.
- AI inference memory architecture, including KV-cache offloading, SSD context tiers, agentic AI and changing CPU-to-GPU memory ratios.
- Emerging memory analysis covering STT-MRAM, SOT-MRAM, VCMA-MRAM, ReRAM, FeRAM, HfO2 ferroelectrics, PCM, NRAM, CeRAM, ULTRARAM and selector-only memory.
- Advanced packaging and integration, including chiplets, fan-out packaging, processing-in-memory and compute-in-memory.
- Global wafer capacity, fabrication utilisation, manufacturing costs, node yields, supply-demand balances and next-generation facility requirements.
- DRAM and NAND pricing cycles, HBM premiums, gross-margin trends and long-term technology cost roadmaps.
- Sustainability analysis covering carbon emissions, water consumption, HBM environmental impacts, energy efficiency and circular-economy initiatives.
- Profiles of 173 companies and long-term roadmaps for quantum, DNA, photonic and neuromorphic memory technologies through 2037.
The report supports semiconductor manufacturers, storage suppliers, investors, data-centre operators, technology companies and policymakers seeking detailed insight into global memory market forecasts, AI memory demand, HBM capacity, NAND and DRAM pricing, emerging memory technologies and the future of data storage infrastructure.
A selection of companies mentioned in this report includes, but is not limited to:
- 3D Plus
- 4DS Memory
- Adata Technology
- Advantest Corporation
- Ambiq Micro
- AMD
- Amkor Technology
- ANAFLASH
- AP Memory
- Apacer Technology
- Applied Materials
- ASE Group
- ASM International
- ASML Holding
- Atomera
- Avalanche Technology
- Axelera AI
- BeSang
- Besi
- Celestial AI
- Cerebras Systems
- CXMT
- Crocus Nanoelectronics
- Crossbar
- d-Matrix
- Dnotitia
- Dosilicon
- eMemory
- Etron Technology
- ESMT
- Everspin Technologies
- Expedera
- Ferroelectric Memory Company
- FERROSemi Technology
- Floadia Corporation
- Fudan Microelectronics
- Giantec Semiconductor
- GigaDevice Semiconductor
- GlobalFoundries
- GlobalWafers
For more information about this report visit https://www.researchandmarkets.com/r/ag4qgw
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